| Event | Date | Location | Presentations |
| HANNOVER MESSE 2018 | 2018 04 23-27 | Hanover, Germany | Open R&D Lithuania booth |
| LPM 2018 | 2018 06 25-29 | Edinburgh,United Kingdom | G. Račiukaitis, Local copper deposition on dielectrics using Selective Surface Activation Induced by Laser (SSAIL) |
| | | M. Vyšniauskas, Selective surface activation induced by laser (SSAIL) method for electronic circuit traces formation of 3D moulded interconnect devices (MID) |
| LANE 2018 | 2018 09 03-06 | Fürth, Germany | K. Ratautas, Laser assisted fabrication of copper traces on dielectrics by electroless plating |
| ICPEPA 11 | 2018 09 10-14 | Vilnius, Lithuania | K. Ratautas, New laser-assisted method for copper circuit fabrication on dielectrics |
| | | G. Mordas, Microstructure and mechanical properties of parts obtained by Direct Metal Laser Sintering |
| | | A. Steponavičiūtė, The resolution study of the 3D printer EOSINT M280 for iron-based powders |
| | | V. Tomkus, Impact of the wall roughness on the quality of micrometric nozzles manufactured from fused silica by hybrid laser processing |
| MID 2018 | 2018 09 25-26 | Wuerzburg, Germany | K. Ratautas, Laser Assisted Selective Metallization of Polymers and Glass |
